Date of Award

Summer 2025

Access Type

Dissertation - Open Access

Degree Name

Doctor of Philosophy in Aerospace Engineering

Department

Aerospace Engineering

Committee Chair

Daewon Kim

Committee Chair Email

kimd3c@erau.edu

First Committee Member

Sirish Namilae

First Committee Member Email

namilaes@erau.edu

Second Committee Member

Foram Madiyar

Second Committee Member Email

MADIYARF@erau.edu

Third Committee Member

Yizhou Jiang

Third Committee Member Email

JIANGY5@erau.edu

College Dean

James W. Gregory

Abstract

The development of embeddable, multi-material wireless microsensors offers transformative potential for structural health monitoring (SHM) in aerospace applications. This work integrates additive manufacturing (AM) techniques with advanced microstructural design to produce flexible, high-resolution sensors that can be directly embedded into polymer substrates. By utilizing the vat photopolymerization process, customized embedded sensors are seamlessly integrated into polymer AM structures. These sensors are then continuously refined, targeting increases in performance, both internal and external. Microstructural enhancements are explored to modify the rheological properties of the fabricated embedded sensing channels and enhance the adhesive bonding between the embedded sensor and the AM structure. Analytical modeling characterizes these advancements and provides the tools necessary to make informed design decisions for future complex sensing applications. Then, the concepts applied to polymer sensors are expanded to ceramic substrates. Design alterations then enable the fabrication of wireless embedded thermal ceramic sensor systems. The addition of multi-material fabrication techniques consequently enables the fabrication of long range wireless strain ceramic sensing systems. These results collectively establish a robust framework for designing and deploying customizable, embeddable microsensors, enabling in-situ monitoring of deformation and temperature, and successfully demonstrating the overall viability of embedded sensors for real-world aerospace sensing applications, as well as potential avenues for further SHM advancements built upon this work.

GS9_Acceptance_Nicholas_Reed_Signed.pdf (344 kB)
GS9_Acceptance

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